data sheet ligitek electronics co.,ltd. property of ligitek only super bright round type led lamps LUR2643-PF doc. no : qw0905- rev. : date : a - 2008 08 - sep. LUR2643-PF pb lead-free parts
note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation ligitek electronics co.,ltd. property of ligitek only part no. LUR2643-PF package dimensions page 1/5 25.0min 1.0min 4.3 3.1 2.9 0.5 typ 2.54typ 3.3 1.5max
storage temperature tstg -40 ~ +100 red note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) emitted material part no LUR2643-PF gaalas spectral halfwidth nm peak wave length pnm viewing angle 2 1/2 (deg) min. water clear lens 66020550 typ. max. 1.5 2.4 350 min. 40 forward voltage @20ma(v) color luminous intensity @20ma(mcd) absolute maximum ratings at ta=25 forward current peak forward current duty 1/10@10khz power dissipation reverse current @5v operating temperature parameter page 2/5 ur 10 120 120 40 -40 ~ +85 ratings i f t opr ir pd i fp symbol ma a mw ma unit ligitek electronics co.,ltd. property of ligitek only part no. LUR2643-PF
ligitek electronics co.,ltd. property of ligitek only 0.0 0.8 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 wavelength (nm) ambient temperature( ) fig.5 relative intensity vs. wavelength r e l a t i v e i n t e n s i t y @ 2 0 m a 1.0 0.0 600 0.5 -40-20 650700750 -40 80 20 04060100 ambient temperature( ) -20040 20100 80 60 1 f o r w a r d c u r r e n t ( m a ) r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a fig.3 forward voltage vs. temperature 0.9 1.0 1.1 1.2 0 1 1.0 1.0 0.5 1.5 2.0 2.5 3.0 1 fig.4 relative intensity vs. temperature forward voltage(v) 3.0 2.04.0 0.0 5.0 0.5 forward current(ma) 100 101000 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 10 100 1000 ur chip fig.2 relative intensity vs. forward current 2.5 1.5 1.0 2.0 3.0 page 3/5 part no. LUR2643-PF
ligitek electronics co.,ltd. property of ligitek only page 4/5 part no. LUR2643-PF dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 120 note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. preheat 60 seconds max 0 0 25 2 /sec max 50 time(sec) 150 100 260 c3sec max 260 temp( c) 5 /sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile
ligitek electronics co.,ltd. property of ligitek only reference standard jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. operating life test low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. page 5/5 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. high temperature high humidity test thermal shock test this test intended to see soldering well performed or not. 1.t.sol=230 5 2.dwell time=5 1sec solderability test 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. part no. LUR2643-PF
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